Glass&Ceramic Silver Conductive Paste,450–700°C Sintering 86±1wt% (450°C Sintering Grade 10g)

Glass & Ceramic Silver Conductive Paste is a silver-based functional conductive material designed for glass, ceramic, silicon, and other rigid substrates requiring high-temperature processing. The material is formulated to provide high electrical conductivity, strong substrate adhesion, and stable conductive layers after sintering. This product series includes two grades with different sintering temperatures. One grade is designed for sintering at approximately 450°C, while the other uses a higher sintering temperature of approximately 700°C. The different processing conditions allow selection according to substrate characteristics and required conductive performance. Both grades are supplied as silver-gray pastes with a viscosity of approximately 30,000–50,000 mPa·s and solids content of approximately 85–86 wt%. Both provide 5B adhesion and low sheet resistance. The materials are suitable for conductive circuits and antennas on glass and ceramic substrates, ceramic substrate interconnects, thick-film circuits, electrodes, and electronic component applications. General Technical Range Form: Silver-gray paste Viscosity: 30,000–50,000 mPa·s Solids Content: 85–86 wt% Adhesion: 5B Sheet Resistance: <4–5 mΩ/□/mil, depending on grade Sintering Temperature: Approximately 450–700°C, depending on grade Sintering Time: 5 minutes Suitable Substrates: Glass, ceramic, silicon, and other compatible rigid substrates Applications: Conductive circuits, antennas, electrodes, thick-film circuits, ceramic substrate interconnects, and electronic components

• Glass and Ceramic Applications — Silver conductive paste designed for forming conductive circuits and electrodes on glass, ceramic, and other rigid high-temperature substrates.
• High Adhesion — Both grades provide 5B adhesion, supporting strong bonding between the conductive layer and compatible substrate surfaces.
• Low Sheet Resistance — Grade-dependent sheet resistance is below 4–5 mΩ/□/mil, providing high electrical conductivity for printed circuit applications.
• Two Sintering Options — Available grades support sintering at approximately 450°C or 700°C for different substrate and processing requirements.
• Electronic Materials Applications — Suitable for ceramic substrate interconnects, thick-film circuits, electrodes, antennas, and electronic component applications.